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Call for Papers

PECCS is sponsored by INSTICC – Institute for Systems and Technologies of Information, Control and Communication


Pervasive and embedded computing and communication is a paradigm that aims at providing trustworthy computing solutions and communication services all the time and everywhere. This entails the need for an interdisciplinary field of R&D that combines signal processing with computer hardware and software technologies, and utilizes and integrates pervasive, wireless, embedded, wearable and/or mobile systems. Applications range from ambient intelligence to ubiquitous multimedia, multidimensional signal processing, sensors, robotics, integrated communication systems and nanotechnologies. PECCS will bring together researchers, engineers and practitioners interested in the theory and applications in these areas.

Papers describing original work are invited in any of the areas listed below. Accepted papers, presented at the conference by one of the authors, will be published in the proceedings of PECCS. Acceptance will be based on quality, relevance and originality. There will be both oral and poster sessions.

Special sessions, dedicated to case-studies and commercial presentations, as well as technical tutorials, dedicated to technical/scientific topics, are also envisaged: companies interested in presenting their products/methodologies or researchers interested in lecturing a tutorial are invited to contact the conference secretariat.


Each of these topic areas is expanded below but the sub-topics list is not exhaustive. Papers may address one or more of the listed sub-topics, although authors should not feel limited by them. Unlisted but related sub-topics are also acceptable, provided they fit in one of the following main topic areas:



  • Security and Privacy
  • Ambient Intelligence
  • Ubiquitous Computing Systems and Services
  • Human-Computer Interaction
  • Context-Aware Applications
  • Pervasive Health
  • Distributed Intelligent Agents
  • Mobile Computing
  • Ubiquitous Multimedia
  • Location Systems and Technology
  • Pervasive Embedded Networks


  • Time-frequency Analysis
  • Signal Processing in Communications
  • Detection and Estimation
  • Image and Multidimensional Signal Processing
  • Multimedia Communication Systems
  • Remote Sensing and Signal Processing
  • Adaptive Systems
  • Wavelet Signal Processing
  • Digital Filter Design and Implementation
  • Software Simulation
  • Microcontroller Applications


  • Software Architectures
  • Pervasive Embedded Devices
  • Networking and Connectivity
  • Micro and Nanotechnology
  • Real Time Systems
  • VLSI Design and Implementation
  • Low-Power Electronics
  • Embedded Robotics
  • Instrumentation and Measurement
  • Sensors and Sensor Networks
  • RFID Applications


Belur V. DasarathyInformation Fusion, United States
Mateo ValeroUniversidad Politecnica de Catalunya, Spain
Alan BurnsUniversity of York, United Kingdom
John StankovicUniversity of Virginia, United States
Stephen MellorFreeter, United Kingdom
Luis M. CorreiaIST/IT-Technical University of Lisbon, Portugal
Thomas HenzingerInstitute of Science and Technology Austria, Austria


Authors should submit a paper in English, carefully checked for correct grammar and spelling, addressing one or several of the conference areas or topics. Each paper should clearly indicate the nature of its technical/scientific contribution, and the problems, domains or environments to which it is applicable. To facilitate the double-blind paper evaluation method, authors are kindly requested to produce and provide the paper WITHOUT any reference to any of the authors, including the authors’ personal details, the acknowledgments section of the paper and any other reference that may disclose the authors’ identity.

Only original papers should be submitted. Authors are advised to read INSTICC's ethical norms regarding plagiarism and self-plagiarism thoroughly before submitting and must make sure that their submissions do not substantially overlap work which has been published elsewhere or simultaneously submitted to a journal or another conference with proceedings. Papers that contain any form of plagiarism will be rejected without reviews.

Authors can submit their work in the form of a Regular Paper, representing completed and validated research, or as a Position Paper, portraying a short report of work in progress or an arguable opinion about an issue discussing ideas, facts, situations, methods, procedures or results of scientific research focused on one of the conference topic areas. All papers must be submitted through the online submission platform PRIMORIS and should follow the instructions and templates that can be found under Guidelines and Templates. After the paper submission has been successfully completed, authors will receive an automatic confirmation e-mail.


All accepted papers will be published in the conference proceedings, under an ISBN reference, on paper and on digital support.
SCITEPRESS is a member of CrossRef ( and every paper on our digital library is given a DOI (Digital Object Identifier).
The proceedings will be submitted for indexation by Thomson Reuters Conference Proceedings Citation Index (CPCI/ISI), DBLP, EI (Elsevier Engineering Village Index) and Scopus.


PECCS Secretariat
Address: Av. D. Manuel I, 27A, 2º esq.
             2910-595 Setúbal - Portugal
Tel.: +351 265 520 184
Fax: +44 203 014 5434


Joaquim FilipePolytechnic Institute of Setúbal / INSTICC, Portugal


César Benavente-PecesUniversidad Politécnica de Madrid, Spain


Marco Aiello, University of Stuttgart, Germany
Jalal Al Muhtadi, King Saud University, Saudi Arabia
Pedro Albertos, Universidad Politécnica de Valencia, Spain
Cristina Alcaraz, University of Malaga, Spain
Alejandro Alonso, Universidad Politécnica de Madrid, Spain
Paul Amer, University of Delaware, United States
Oliver Amft, TU Eindhoven, Netherlands
Emmanuelle Anceaume, IRISA / CNRS, France
Plamen Angelov, Lancaster University, United Kingdom
Saddek Bensalem, Verimag Laboratory, France
Fernando Boavida, CISUC - Centre for Informatics and Systems of the University of Coimbra, Portugal
Johann Bourcier, Université de Rennes 1 / IRISA, France
Florian Brandner, Danmarks Tekniske Universitet, Denmark
Jan Broenink, University of Twente, Netherlands
Roy Campbell, University of Illinois at Urbana-Champaign, United States
João Canas Ferreira, Universidade do Porto - Faculty of Engineering, Portugal
Juan-Carlos Cano, Universidad Politécnica de Valencia, Spain
João M. P. Cardoso, Universidade do Porto, Faculdade de Engenharia (FEUP), Portugal
Marcos Cavenaghi, Humber Institute of Technology and Advanced Learning, Canada
Jiann-Liang Chen, National Taiwan University of Science and Technology, Taiwan
Tom Chen, Swansea University, United Kingdom
De-Jiu Chen, KTH Royal Institute of Technology, Sweden
Albert Cheng, University of Houston, United States
Diane Cook, Washington State University, United States
Marilia Curado, Universidade de Coimbra, Portugal
Juan Antonio de la Puente, Universidad Politecnica de Madrid, Spain
Luca De Nardis, Università degli Studi di Roma La Sapienza, Italy
Alex Dean, North Carolina State University, United States
Franca Delmastro, National Research Council of Italy, Italy
Jianguo Ding, University of Skövde, Sweden
Christos Douligeris, University of Piraeus, Greece
Schahram Dustdar, Vienna University of Technology, Austria
Ibrahiem El Emary, King Abdulaziz University, Saudi Arabia
Jeffrey Evans, Purdue University, United States
Andras Farago, The University of Texas at Dallas, United States
John Fitzgerald, Newcastle University, United Kingdom
Marisol Garcia Valls, Universidad Carlos III de Madrid, Spain
Luis Javier García Villalba, Universidad Complutense de Madrid, Spain
David Greaves, University of Cambridge, United Kingdom
Aseem Gupta, Freescale Semiconductor Inc., United States
Jörg Hähner, Universität Augsburg, Germany
Markus Hofmann, Bell Labs, United States
Niklas Holsti, Tidorum Ltd, Finland
Peizhao Hu, NICTA, Australia
Manfred Huber, University of Texas at Arlington, United States
Alexei Iliasov, Newcastle University, United Kingdom
Jadwiga Indulska, The University of Queensland, Australia
Tohru Ishihara, Kyoto University, Japan
Hai Jiang, Arkansas State University, United States
Vana Kalogeraki, Athens University of Economics and Business, Greece
Heikki Kariniemi, Tampere University of Technology, Finland
Abdelmajid Khelil, Landshut University of Applied Sciences, Germany
Jens Knoop, Technische Universität Wien, Austria
Xenofon Koutsoukos, Vanderbilt University, United States
Srdjan Krco, Ericsson, Serbia
Tei-wei Kuo, National Taiwan University & Academia Sinica, Taiwan
Miguel Labrador, University of South Florida, United States
Frédéric Le Mouël, INRIA/INSA Lyon, France
Yann-Hang Lee, Arizona State University, United States
Fei Li, Siemens AG, Austria, Austria
Jian Li, Shanghai Jiao Tong University, China
Weifa Liang, The Australian National University, Canberra, Australia
Jaime Lloret Mauri, Universidad Politecnica de Valencia, Spain
Giuseppe Lo Re, University of Palermo, Italy
Martin Maier, INRS, Canada
Klaus Marius Hansen, University of Copenhagen, Denmark
Matthieu Martel, LAMPS - Université de Perpignan, France
Samy Meftali, Uniuversite de Lille 1 - INRIA, France
Nirvana Meratnia, University of Twente, Netherlands
Florian Michahelles, ETH Zürich, Switzerland
S. F. Midkiff, Virginia Tech, United States
Neeraj Mittal, The University of Texas at Dallas – Richardson, United States
Parag Mogre, Siemens AG, Germany
Jose A. Montenegro, University of Malaga, Spain
Jogesh K. Muppala, Hong Kong University of Science and Technology, Hong Kong
Jin Nakazawa, Keio University, Japan
Brian Nielsen, Aalborg University, Denmark
Paulo Novais, Universidade do Minho, Portugal
Nir Oren, University of Aberdeen, United Kingdom
George Perry, University of Texas at San Antonio, United States
Santi Phithakkitnukoon, The Open University, United Kingdom
Vincenzo Piuri, Università degli Studi di Milano, Italy
Christian Poellabauer, University of Notre Dame, United States
Teade Punter, Embedded Systems Institute, Netherlands
Peter Puschner, Vienna University of Technology, Austria
Leonardo Querzoni, Università degli Studi di Roma La Sapienza, Italy
Sita Ramakrishnan, Retired Acdemic from Faculty of IT, Monash University, Australia
Bernhard Rinner, Klagenfurt University, Austria
Christine Rochange, University of Toulouse, France
Rodrigo Roman, University of Malaga, Spain
Sushmita Ruj, University of Ottawa, Canada
Alessandra Russo, Imperial College London, United Kingdom
Johannes Schmitt, ABB Corporate Research Center, Germany
Holger Schwarz, University of Stuttgart, Germany
Enzo Pasquale Scilingo, Università di Pisa, Italy
Zary Segal, University of Maryland, Baltimore County - UMBC, United States
Lakmal Seneviratne, King's College London, United Kingdom
Jie Shao, National University of Singapore, Singapore
Behrooz Shirazi, Washington State University, United States
Agusti Solanas, Universitat Rovira i Virgili, Spain
Basile Starynkevitch, CEA LIST, France
Neeraj Suri, Technische Universität Darmstadt, Germany
Jarmo Takala, Tampere University of Technology, Finland
Ken Takeuchi, Chuo University, Japan
Yoshiaki Taniguchi, Osaka University, Japan
Joyce Tokar, Pyrrhus Software, United States
Martin Törngren, Kungliga Tekniska högskolan, Sweden
Vittorio Trecordi, ICT Consulting, Italy
Jan Tretmans, TNO Embedded Systems Innovation, Netherlands
Konrad Trifunovic, Intel Technology Poland, Poland
Alicia Triviño, University of Málaga, Spain
Steve Uhlig, Technische Universität Berlin (TUB)/Deutshe Telekom Laboratories, Germany
Jaco van de Pol, University of Twente, Netherlands
Bing Wang, University of Hull, United Kingdom
Sheng-De Wang, National Taiwan University, Taiwan
Jules White, Virginia Tech, United States
Matthias Wieland, Daimler AG, Germany
Katinka Wolter, Freie Universität Berlin, Germany
Raj Yavatkar, Intel Corporation, United States
Hee Yong Youn, Sungkyunkwan University, Korea, Republic of
Zhiyong Yu, TELECOM SudParis/ Fuzhou University, China
Chang Wu Yu, Chung Hua University, Taiwan
Sherali Zeadally, University of Kentucky, United States
Olivier Zendra, INRIA Nancy - Grand Est, France
Ty Znati, University of Pittsburgh, United States